Multiphysics Simulation: An IEEE Spectrum Insert
Application Builder and COMSOL Server: A ReviewWilliam T. Vetterling, Zink Imaging, MA, USA
William Vetterling, research fellow and manager of the Image Science Laboratory at Zink Imaging, created an intuitive and easy-to-use simulation app that computes the current distribution and heating throughout a thermal print head design and displays the computed results in a clear, uncluttered way. The app was built with the Application Builder tool available within COMSOL Multiphysics®.
Vetterling built the app by selecting inputs for the number of electrodes in the print head and their width. He expanded the app's functionality with the Form Editor and Method Editor tools. The app can be deployed to colleagues with COMSOL Server™.
Simulation app built using COMSOL Multiphysics® and the Application Builder tool. Current distribution and heating throughout a multi-pixel thick-film thermal print head is shown.
- ZINK_IMAGING_CN15.pdf - 0.54MB