Deadline Announced to Submit Presentation Abstracts for the COMSOL Conference 2019
Simulation and analysis software users are invited to submit abstracts by 28 June 2019, for an opportunity to present their work at the COMSOL Conference 2019 Bangalore.
BANGALORE, INDIA (March 20, 2019) — COMSOL has announced that the Program Committee for the COMSOL Conference 2019 has begun to accept abstract submissions for posters and papers.
Presenters at the COMSOL Conference gain exposure to a worldwide audience, providing them with the opportunity to showcase their work to simulation specialists throughout industry and academia.
"Presenting at the COMSOL Conference is a great opportunity to share our modeling and simulation work with like-minded individuals and gain recognition for our contribution within the simulation community," said Fritz Lange, Research Associate, Fraunhofer. "Likewise, we learn about many different applications from other engineers and take that inspiration back home to improve on our work directly."
The papers and posters accepted for presentation will reach approximately 2000 conference attendees across the globe. Additionally, the conference proceedings are then published online for public access, amplifying the reach beyond those directly in attendance.
The COMSOL Conference 2019 2019 Bangalore will be held 28-29 November, 2019, at ITC Gardenia in Bengaluru, Karnataka. For a list of worldwide events and deadlines, visit: www.comsol.co.in/conference/.
Suggested topic areas for papers and posters include:
- AC/DC electromagnetics
- Acoustics and vibrations
- Batteries, fuel cells, and electrochemical processes
- Bioscience and bioengineering
- Chemical reaction engineering
- Computational fluid dynamics
- Electromagnetic heating
- Geophysics and geomechanics
- Heat transfer and phase change
- MEMS and nanotechnology
- Optics, photonics, and semiconductors
- Optimization and inverse methods
- Particle tracing
- Piezoelectric devices
- Plasma physics
- RF and microwave engineering
- Simulation methods and teaching
- Structural mechanics and thermal stresses
- Transport phenomena
COMSOL is a global provider of simulation software for product design and research to technical enterprises, research labs, and universities. Its COMSOL Multiphysics® product is an integrated software environment for creating physics-based models and simulation applications. A particular strength is its ability to account for coupled or multiphysics phenomena. Add-on products expand the simulation platform for electromagnetics, structural, acoustics, fluid flow, heat transfer, and chemical applications. Interfacing tools enable the integration of COMSOL Multiphysics® simulations with all major technical computing and CAD tools on the CAE market. Simulation experts rely on COMSOL Compiler™ and COMSOL Server™ to deploy applications to their design teams, manufacturing departments, test laboratories, and customers throughout the world. Founded in 1986, COMSOL has 19 offices worldwide and extends its reach with a network of distributors.