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Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Full System Modeling and Validation of the Carbon Dioxide Removal Assembly - new

R. F. Coker[1], J. Knox[1]
[1]NASA Marshall Space Flight Center, Huntsville, AL, USA

The Atmosphere Revitalization Recovery and Environmental Monitoring (ARREM) project was initiated in September of 2011 as part of the Advanced Exploration Systems (AES) program. Under the ARREM project, testing of sub-scale and full-scale systems has been combined with multiphysics computer simulations for evaluation and optimization of subsystem approaches. In particular, this paper describes ...

Short-Term Behavior and Steady-State Value of BHE Thermal Resistance - new

S. Lazzari[1], A. Priarone[2],
[1]DIN, University of Bologna, Bologna, Italy
[2]DIME-TEC, University of Genova, Genova, Italy

The transient behavior of the thermal resistance of single and double U-tube borehole heat exchangers (BHEs) is investigated numerically by means of COMSOL Multiphysics® software with reference to the 2D cross section of usually employed BHEs. The study is performed in a dimensionless parametrical form, the parameters being the ratio between the thermal conductivities of grout and ground, the ...

Numerical Simulation of Chamber Design for Pulsed Electric Fields Processing of Wet Olive Pomace - new

N. Varga[1], I. Perales[2], A. Portugal[2]
[1]ATEKNEA Solutions Hungary, Budapest, Hungary
[2]ATEKNEA Solutions Catalonia, Barcelona, Spain

The application of pulsed electric fields (PEF) is well known in the food industry as an advanced technology for mass transfer improvement. A new potential adaptation area of PEF could be extracting a valuable antioxidant called polyphenol from wet olive pomace (WOP) which is a by-product of olive oil production. The modelling includes the PEF effects on the WOP which is flowing through a ...

Extraction of Thermal Characteristics of Surrounding Geological Layers of a Geothermal Heat Exchanger by COMSOL Multiphysics® Simulations - new

N. Aranzabal[1], J. Martos[1], J. Soret[1], J. Torres[1], R. García-Olcina[1], Á. Montero[2]
[1]Technical School of Engineering, University of Valencia, Valencia, Spain
[2]Department of Applied Physics, Politechnical University of Valencia, Valencia, Spain

It has been demonstrated that is possible obtain the thermal parameters of geological layers of a BHE (Borehole Heat Exchanger) by fitting temperature evolution in an observer pipe inserted into borehole.

Virtual Pharmacokinetic Model of the Human Eye - new

L. Murtomäki[1], S. Kotha[2]
[1]Aalto University, Greater Helsinki, Finland
[2]University Of Helsinki, Helsinki, Finland

There is a great need for an effective drug treatment of the posterior eye, as the major reason for visual disability in industrial countries is Age-related Macular Degeneration (AMD). In USA alone, there are almost 2 million people affected by AMD [1]. A virtual pharmacokinetic 3D model of the human eye is built to address this problem, using COMSOL Multiphysics® software, based on the Finite ...

Assessing the Potential of Ventilated Facades on Reducing a Buildings’ Thermal Load Using Decoupled COMSOL Simulations

J. van Schijndel[1], C. van Dronkelaar[1]
[1]Eindhoven University of Technology, Eindhoven, The Netherlands

Solar radiation is a prominent contributor of energy in buildings, and can be transmitted directly into a building through opaque surfaces, but it can also be absorbed by building components (i.e. walls, roofs etc.). This study discusses the use and effect of ventilated facades, with an external facade cladding, a sub-structure anchored to the wall surface of the building under solar radiation, ...

RFID-Enabled Temperature Sensor

I.M. Abdel-Motaleb[1], K. Allen [1]
[1]Department of Electrical Engineering, Northern Illinois University, DeKalb, IL, USA

The design of a RFID-enabled temperature sensor is described in this paper. In this sensor, a change in temperature causes structural beams to bend, which results in a proportional displacement of the plates of the capacitor. Plates\' displacement results, in turn, in changing the value of its capacitance. The capacitor of the sensor is coupled to the LC resonant network of a passive RFID tag. ...

Analysis of Heat Transfer in a Complex Three Dimensional Structure Fabricated by Additive Manufacturing - new

C. Settle[1], K. Hoshino[1]
[1]Biomedical Engineering Department, University of Connecticut, Storrs, CT, USA

The goal of this study was to create a three dimensionally designed biomedical device with multiple functionalities and analyze its simulated heat transfer. The device would be fabricated through additive manufacturing; specifically electron beam melting (EBM). EBM has a feature size constraint of 1 mm (acceptable for this design) and is only capable of manufacturing titanium alloys [2]; a ...

Numerical Simulation of Evaporation Processes in Electron Beam Welding - new

E. Salomatova[1], D. Trushnikov[1], V. Belenkiy[1], V. Tsaplin[1]
[1]Perm National Research Polytechnic University, Perm, Russia

In this paper describes an original method for indirect measurement of the vapor pressure and temperature in the keyhole in electron beam welding. This method is based on the determination of the concentration of chemical elements in the vapor above the welding zone. Taking into account these data model is built 2D diffusion processes with heat and mass transfer elements in the melt, which ...

Thermal Simulation of FCBGA Package with Heat Sink

M. R. Naik[1]
[1]Nitte Meenakshi Institute of Technology, Bengaluru, Karnataka, India

In a modern IC design, the capability of predicting the temperature profile is critically important as well as cooling and related thermal problems are the principal challenges. To address these challenges, thermal analysis must be embedded within IC synthesis. This paper presents thermal analysis of the FCBGA chip with a 4mm×4mm×0.3mm silicon die. The silicon die dissipates heat flux of ...