Copper Electroplating Parameters Optimization

L. M. A. Ferreira [1],
[1] CERN , Geneva, Switzerland
Published in 2015

Aqueous based copper electroplating seems the most reliable, flexible, cost effective method to create a copper layer on stainless steel coupler devices; this however, doesn’t imply a straightforward application, as subcomponents geometry is complex and tolerances are tight. At CERN, two existing copper electroplating baths were tested to evaluate the feasibility of plating three couplers subcomponents within the demanded dimensional tolerances. COMSOL Multiphysics® Electrodeposition Module was used to optimize the counter electrode geometry with the objective of achieving an as even as possible copper layer thickness, as well as obtaining the plating parameters such as applied current density and plating time.