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Laser Heating of a Silicon Wafer

Application ID: 13835


A silicon wafer is heated up by a laser that moves radially in and out over time. In addition, the wafer itself is rotated on its stage. The incident heat flux from the laser is modeled as a spatially distributed heat source on the surface. The transient thermal response of the wafer is shown. The peak, average, and minimum temperature during the heating process is computed, as well as the temperature variations across the wafer.

This application was built using the following:

COMSOL Multiphysics®

The combination of COMSOL® products required to model your application depends on the physics interfaces that define it. Particular physics interfaces may be common to several products (see the Specification Chart for more details). To determine the right combination of products for your project, you should evaluate all of your needs in light of each product's capabilities, consultation with the COMSOL Sales and Support teams, and the use of an evaluation license.