Joule Heating of a Microactuator - Distributed Parameter Version
Application ID: 16943
A model of a thermal microactuator requires the coupled simulation of electric current conduction with heat generation, heat conduction, and structural stresses and strains due to thermal expansion.
The purpose of this model is to demonstrate how to access the cluster computing functionality in COMSOL from COMSOL Desktop and use it to submit a batch job to a cluster through a job scheduler. The model takes advantage of the distributed parameter functionality in COMSOL. The model also demonstrates how you can measure the speedup of COMSOL on your cluster.
This model is included as an example in the following products:COMSOL Multiphysics®
however additional products may be needed to reproduce it. This example may be created and run using components from the following product combinations:
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Specification Chart and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.