Technical Papers and Presentations

Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Design of a MEMS Capacitive Comb-drive Accelerometer

T. Kaya[1], B. Shiari[2], K. Petsch[1], and D. Yates[2]
[1]Central Michigan University, School of Engineering and Technology, Mount Pleasant, MI
[2]University of Michigan, Dept. of Electrical Engineering and Computer Science, Ann Arbor, MI

In this work, a MEMS low-g accelerometer with three sensitive directions is designed for health monitoring applications. The accelerometer may have different sensitivity in different axes. The proof-mass of the device is suspended by four serpentine springs, and the comb drive structure is used to form the differential capacitor to measure the displacement of the proof-mass. The structure has an ...

Analysis of Thermoelectric Phenomena

J. Crompton, S. Yushanov, L. Gritter, and K. Koppenhoefer
AltaSim Technologies, LLC.
Columbus, OH

Thermoelectric phenomena provide the direct conversion of heat into electricity or electricity into heat, the phenomena is described by three related mechanisms: the Seebeck, Peltier and Thomson effects. Thermoelectric devices have found many applications ranging from temperature measurement, solid state heating or cooling and direct energy conversion from waste heat. In this paper, analysis ...

Fluid-Structure Interaction Analysis of a Peristaltic Pump

N. Elabbasi, J. Bergstrom, and S. Brown
Veryst Engineering, LLC.
Needham, MA

Peristaltic pumping is an inherently nonlinear multiphysics problem where the deformation of the tube and the pumped fluid are strongly coupled. We used COMSOL Multiphysics to investigate the performance of a 180 degree rotary peristaltic pump with two metallic rollers, and an elastomeric tube pumping a viscous Newtonian fluid. The model captures the peristaltic flow, the flow fluctuations ...

Carbon MEMS Accelerometer

J. Strong, and C. Washburn
Sandia National Laboratories
Albuquerque, NM

The newly emerging field of carbon-based MEMS (C-MEMS) attempts to utilize the diverse properties of carbon to push the performance of MEMS devices beyond what is currently achievable. Our design employs a carbon-carbon composite using nano-materials to build a new class of MEMS accelerometer that is hyper-sensitive over a dynamic range from micro-G to hundreds of G’s – far surpassing the ...

Analyzing Drug Delivery and Osteoblast Growth on a Porous Scaffold in a Perfusion Bioreactor

A. Sun, and S. Murray
Dept. of Biomedical Engineering
UCLA, Los Angeles, CA

Implantable Collagen sponges are used in Spinal Surgery as Drug Delivery Scaffolds. An optimal concentration of growth factor that strikes a balance between bone growth and adverse diffusion effects is difficult to find. The porous sponge also serves as a scaffold for Osteoblast growth, and fluid shear has been shown to mediate biological effects on that cell type. We use COMSOL Multiphysics ...

Optimization of Design Parameters of a Novel MEMS Strain Sensor used for Structural Health Monitoring of Highway Bridges

H. Saboonchi, and D. Ozevin
Civil Engineering Department
University of Illinois at Chicago
Chicago, IL

The novel Micro Electro Mechanical System (MEMS) based Piezoresistive stain sensor is presented in this paper. The main goal of this sensor is to monitor the localized strain in the highway bridges especially near the crack tips. Monitoring the crack growth on the bridges can lead to early detection and prevention of bridge failures. The COMSOL Multiphysics software was used to optimize the ...

Modeling Convection during Melting of a Phase Change Material

D. Groulx, and R. Murray
Mechanical Engineering
Dalhousie University
Halifax, NS

COMSOL Multiphysics can be used to model a latent heat energy storage system. A 2D numerical study was performed to simulate melting of a PCM including both conduction and convective heat transfer. The heat transfer in fluids and laminar flow physics interfaces were used. To model natural convection, proper volume force was applied to the PCM. The viscosity was input as a piecewise, continuous ...

Simulations of MEMS Based Piezoresistive Accelerometer Designs in COMSOL

N. Bhalla[1], S. Li[2], and D. Chung[1]
[1]Chung Yuan Christian University, Taiwan, (R.O.C)
[2]National Tsing Hua University, Taiwan, (R.O.C)

Different configurations of MEMS based accelerometer has been made and analysed using COMSOL Multiphysics. The designs presented in this paper consist of a square shaped proof mass with flexures supporting it. Different position and varied number of supporting flexures attached to the proof mass makes each configuration distinct. The piezoresistors are placed near the proof mass and frame ends on ...

Design of Cooling System for Electronic Devices Using Impinging Jets

P. Lin[1], C. Chang[2], H. Huang[3], and B. Zheng[4]
[1]Mechanical and Aerospace Eng., Rutgers, The State University of New Jersey, Piscataway, NJ
[2]FTR Systems (Shanghai) Inc., Shanghai, China
[3]PolarOnyx, Inc., San Jose, CA
[4]School of Mechatronics Eng., University of Electronic Science and Technology of China, Chengdu, China

The heat sink designs using impinging liquid jets, which form stagnation flows, feature uniform heat transfer coefficients, and provide thin thermal boundary layers, are studied to reduce the heat from GPUs. Three different designs using central, micro, and uniform-cross-section (UCS) central jets are studied and simulated in COMSOL. The efficiency factors, defined as the ratio of total ...

Power Transistor Heat Sink Design Trade-offs

T. Eppes, I. Milanovic, and G. Quarshie
University of Hartford
West Hartford, CT

Power transistors require heat sinks to dissipate thermal energy and keep junction temperatures below the recommended limit. The reliability and longevity of any semiconductor device is inversely proportional to the junction temperature. Hence, a significant increase in reliability and component life can be achieved by a small reduction in operating temperature. A range of heat sink designs ...

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