Applying Grain Continuum Models to Stress Induced Grain Evolution in Next Generation Integrated Circuit Interconnects

D.N. Bentz, M. Bloomfield, J-Q. Lu, R.J. Gutmann, and T.S. Cale
Focus Center—New York, Rensselaer: Interconnects for Hyperintegration

We discuss the use of 3D grain continuum modeling to study grain boundary migration driven by differences in strain energy density.

COMSOL Multiphysics is used to compute stresses and strain energy densities in polycrystalline structures caused by temperature changes.

The grain boundary speeds are computed using a simple model that relates them to grain boundary mobility and differences in strain energy density on either side of grain boundaries. The grain boundaries are moved using a multiple-material interface tracking program, PLENTE.

In our second example, a body fitted mesh is imported into CM where speeds are computed and sent to PLENTE, where the grain structure is evolved.

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